Structured glass substrates in wafer- and panel level packaging: Status and recent achievements.

Abstract Glasses can be used as core substrate for panel- and/or wafer-level packaging to achieve heterogeneous integration of chiplets and integrated passives in increasingly complex packages. Glass has a large number advantages: The stiffness glass (i) allows manufacturing highly accurate buildup layers. These layers have precision 1μm below on dies with sizes 50mm x more, needed antenna package (AiP) applications high performance computing (HPC). Special glasses made adjusted thermal expansion (CTE) (ii), either silicon or larger allow packages epoxy molds metallization that see loads during operation. also optimized very good dielectric properties (iii) utilized antenna-in-package applications. But most all, economic structuring techniques (iv) which provide millions vias thousands cut-outs panel are important being developed. SCHOTTs Structured Portfolio FLEXINITY® related technologies an excellent starting point sophisticated structured substrates required Advanced Packaging. biggest hurdle large-scale commercialization is industrial readiness along the whole process chain. This needed, bring like IC-packaging, RF-MEMS medical diagnostics or, combination cutouts fan-out, embedding active passive components. In addition, processes adhesion, electrical geometric accuracy step. current manuscript, we review status discuss our contribution towards achieving packaging.